Introduction to Semiconductor-related Equipment Development: Vacuum Attachment Device
A compact tabletop device that takes up no space! No bubbles will form between the wafer and the film.
The "Vacuum Adhesive Device" is a product that uses a vacuum method to attach without air bubbles between the wafer and the film. It is a compact tabletop device that does not take up much space and does not require skilled operators. Additionally, it can be customized according to customer requests. 【Features】 ■ Tape application without air bubbles between the wafer and the film ■ Vacuum method for attachment ■ Compact tabletop device that does not take up much space ■ No need for skilled operators ■ Compatible with UV-curable film tape ■ Supports various films by changing the attachment unit *For more details, please refer to the PDF document or feel free to contact us.
- Company：都波岐精工 本社・工場
- Price：Other
